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Dimensional stability at high temperature,excellent electricity insulation,instantaneous maximum temperature reach 300°C,and no glue residue after removal。
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1.Used in mask for protection of gold fingers of printed circuit boards during wave solder or solder dip process。 2.Good performance at insulating,heat resistance,radiation and chemical resistance。 3.Used in the electric circuit of heater, power supply and soft PCB.。 4. Good insulation, used in the capacitors, welding prevented, motors and line head and soldering。
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Material Total Thickness Base Film Width Length Adhesion Operating Temp.
(μm) (μm) (mm) (M) (g/25mm) (°C)
Polyimide 50~100 25~50 490 33~100 500~1000 5~260
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